Invention Application
- Patent Title: METHODS FOR POLYMER COEFFICIENT OF THERMAL EXPANSION (CTE) TUNING BY MICROWAVE CURING
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Application No.: US15451603Application Date: 2017-03-07
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Publication No.: US20170365490A1Publication Date: 2017-12-21
- Inventor: YUEH SHENG OW , RUI WANG , TUCK FOONG KOH , XIN WANG
- Applicant: APPLIED MATERIALS, INC.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H05B6/70 ; H05B6/64 ; H01L21/3105 ; H01L23/29 ; H01L21/67 ; H05B6/80 ; H05B6/68
Abstract:
Methods of curing polyimide to tune the coefficient of thermal expansion are provided herein. In some embodiments, a method of curing a polymer layer on a substrate, includes: (a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature; and (b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature to cure the polymer layer.
Information query
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