公开(公告)号：US20170365490A1

公开(公告)日：2017-12-21

申请号：US15451603

申请日：2017-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： YUEH SHENG OW ,  RUI WANG ,  TUCK FOONG KOH ,  XIN WANG

IPC: H01L21/56 ,  H05B6/70 ,  H05B6/64 ,  H01L21/3105 ,  H01L23/29 ,  H01L21/67 ,  H05B6/80 ,  H05B6/68

CPC classification number: H01L21/565 ,  H01L21/31058 ,  H01L21/56 ,  H01L21/67115 ,  H01L21/67248 ,  H01L23/293 ,  H05B6/645 ,  H05B6/68 ,  H05B6/70 ,  H05B6/705 ,  H05B6/80

Abstract: Methods of curing polyimide to tune the coefficient of thermal expansion are provided herein. In some embodiments, a method of curing a polymer layer on a substrate, includes: (a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature; and (b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature to cure the polymer layer.