Invention Application
- Patent Title: Substrate and the Method to Fabricate Thereof
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Application No.: US15823579Application Date: 2017-11-28
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Publication No.: US20180082979A1Publication Date: 2018-03-22
- Inventor: BAU-RU LU , MING-CHIA WU , SHAO WEI LU
- Applicant: CYNTEC CO., LTD.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H05K5/02 ; H01L23/552 ; H01L25/00 ; H05K5/06 ; H05K1/11 ; H05K3/42 ; H05K7/02 ; H05K7/20 ; H01L23/538 ; H01L23/498 ; H01L23/40 ; H01L23/373 ; H01L23/36 ; H01L23/13 ; H01L23/31
Abstract:
The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.
Public/Granted literature
- US10128214B2 Substrate and the method to fabricate thereof Public/Granted day:2018-11-13
Information query
IPC分类:
