- 专利标题： Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
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申请号： US15730758申请日： 2017-10-12
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公开(公告)号： US20180102302A1公开(公告)日： 2018-04-12
- 发明人: Andreas GRASSMANN , Wolfram HABLE , Juergen HOEGERL , Angela KESSLER , Ivan NIKITIN , Achim STRASS
- 申请人： Infineon Technologies AG
- 优先权： DE102016119485.9 20161012
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/492 ; H01L23/66 ; H01L23/00
摘要：
A chip carrier which comprises a thermally conductive and electrically insulating sheet, a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet, wherein the first electrically conductive structure and the second electrically conductive structure extend beyond a lateral edge of the sheet.
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