A plating product fabrication method includes forming a first concentrate. The concentrate includes a metal species, such as Tin, and a trace amount of an alpha emitting species, such as Polonium. The plating product fabrication method also includes creating a circuit between a filtering anode and a filtering cathode and reducing the alpha emitting species from the concentrate by plating the alpha emitting species upon the filtering cathode. In this manner, a purified concentrate is formed. The purified concentrate may be utilized to plate the metal species upon a plating cathode. The purified concentrate may be utilized to form a purified metal species.