- 专利标题: Manufacturing a package using plateable encapsulant
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申请号: US16514853申请日: 2019-07-17
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公开(公告)号: US20190341324A1公开(公告)日: 2019-11-07
- 发明人: Sook Woon CHAN , Chau Fatt CHIANG , Kok Yau CHUA , Soon Lock GOH , Swee Kah LEE , Joachim MAHLER , Mei Chin NG , Beng Keh SEE , Guan Choon Matthew Nelson TEE
- 申请人: Infineon Technologies AG
- 优先权: DE102016103790.7 20160303
- 主分类号: H01L23/31
- IPC分类号: H01L23/31 ; H01L23/29 ; C23C18/18 ; C23C18/16 ; C09D5/24 ; C09D5/00 ; C09D201/00 ; H01L21/56 ; C23C18/34 ; H01L23/552 ; H01L23/66 ; H01L23/00
摘要:
A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.
公开/授权文献
- US11081417B2 Manufacturing a package using plateable encapsulant 公开/授权日:2021-08-03
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