Invention Application
- Patent Title: TAPERED CORNER PACKAGE FOR EMI SHIELD
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Application No.: US15968774Application Date: 2018-05-02
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Publication No.: US20190341352A1Publication Date: 2019-11-07
- Inventor: Hong Bok WE , Chin-Kwan KIM , Jaehyun YEON , Manuel ALDRETE , David Fraser RAE
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L21/683 ; H01L21/3105 ; H01L23/29
Abstract:
A semiconductor package comprises a substrate, a die mounted on the substrate, and a mold formed over the die and on the substrate, the mold having a top surface and a plurality of tapered side surfaces, wherein the tapered side surfaces provide uniform thickness of an electromagnetic interference (EMI) shielding film.
Information query
IPC分类:
