Invention Application
- Patent Title: ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FOR FINE PITCH APPLICATIONS
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Application No.: US16490517Application Date: 2017-03-31
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Publication No.: US20200072871A1Publication Date: 2020-03-05
- Inventor: Pooya Tadayon , Joe F. Walczyk , Keith J. Marting
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- International Application: PCT/US2017/025515 WO 20170331
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H05K1/11 ; H05K3/42 ; H05K3/00 ; H05K3/40

Abstract:
Space transformation technology for probe cards at sort is disclosed. In one example, a space transformer transforms a pitch of electrical contacts from a first distribution to a second distribution. The space transformer comprises a substrate with opposite first and second sides; and vias extending through the substrate between the first and second sides and oriented at different angles with respect to one another. In one example, a tester system or probe card for a die comprises a printed circuit board (PCB) with pads having a pad pitch; and a space transformer operatively coupled to the PCB, and having vias extending from the pads of the PCB through the space transformer at different angles with respect to one another and configured to electrically connect to contacts on the die having a contact pitch different than the pad pitch.
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