公开(公告)号：US20200072871A1

公开(公告)日：2020-03-05

申请号：US16490517

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Pooya Tadayon ,  Joe F. Walczyk ,  Keith J. Marting

IPC: G01R1/073 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/40

Abstract: Space transformation technology for probe cards at sort is disclosed. In one example, a space transformer transforms a pitch of electrical contacts from a first distribution to a second distribution. The space transformer comprises a substrate with opposite first and second sides; and vias extending through the substrate between the first and second sides and oriented at different angles with respect to one another. In one example, a tester system or probe card for a die comprises a printed circuit board (PCB) with pads having a pad pitch; and a space transformer operatively coupled to the PCB, and having vias extending from the pads of the PCB through the space transformer at different angles with respect to one another and configured to electrically connect to contacts on the die having a contact pitch different than the pad pitch.