Invention Application
- Patent Title: ETCH STOP LAYER FOR USE IN FORMING CONTACTS THAT EXTEND TO MULTIPLE DEPTHS
-
Application No.: US16149711Application Date: 2018-10-02
-
Publication No.: US20200105886A1Publication Date: 2020-04-02
- Inventor: Wei Hong , Hui Zang , Hsien-Ching Lo
- Applicant: GLOBALFOUNDRIES Inc.
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L27/12 ; H01L29/06 ; H01L21/84 ; H01L21/02 ; H01L21/768 ; H01L21/311 ; H01L21/3105 ; H01L29/08 ; H01L21/762 ; H01L21/027

Abstract:
Structures for a field-effect transistor and methods for fabricating a structure for a field-effect transistor. First and second device structure are respectively formed in first and second device regions, and a first dielectric layer is formed over the first and second device regions. The first dielectric layer includes a recess defining a step at a transition between the first and second device regions, and a second dielectric layer is arranged within the recess in the first dielectric layer. A third dielectric layer is arranged over the first dielectric layer in the first device region and over the second dielectric layer in the second device region. A contact, which is coupled with the second device structure, extends through the first, second, and third dielectric layers in the second device region.
Public/Granted literature
- US10714577B2 Etch stop layer for use in forming contacts that extend to multiple depths Public/Granted day:2020-07-14
Information query
IPC分类: