Invention Grant
- Patent Title: Etch stop layer for use in forming contacts that extend to multiple depths
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Application No.: US16149711Application Date: 2018-10-02
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Publication No.: US10714577B2Publication Date: 2020-07-14
- Inventor: Wei Hong , Hui Zang , Hsien-Ching Lo
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L29/08 ; H01L27/12 ; H01L29/51 ; H01L29/49 ; H01L29/165 ; H01L29/78 ; H01L21/84 ; H01L21/02 ; H01L21/768 ; H01L21/311 ; H01L21/3105 ; H01L21/762 ; H01L21/027 ; H01L21/28 ; H01L21/285 ; H01L29/66

Abstract:
Structures for a field-effect transistor and methods for fabricating a structure for a field-effect transistor. First and second device structure are respectively formed in first and second device regions, and a first dielectric layer is formed over the first and second device regions. The first dielectric layer includes a recess defining a step at a transition between the first and second device regions, and a second dielectric layer is arranged within the recess in the first dielectric layer. A third dielectric layer is arranged over the first dielectric layer in the first device region and over the second dielectric layer in the second device region. A contact, which is coupled with the second device structure, extends through the first, second, and third dielectric layers in the second device region.
Public/Granted literature
- US20200105886A1 ETCH STOP LAYER FOR USE IN FORMING CONTACTS THAT EXTEND TO MULTIPLE DEPTHS Public/Granted day:2020-04-02
Information query
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