Invention Application
- Patent Title: REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
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Application No.: US16181876Application Date: 2018-11-06
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Publication No.: US20200144200A1Publication Date: 2020-05-07
- Inventor: Erik Nino TOLENTINO , Chee Hiong CHEW , Yusheng LIN , Swee Har KHOR
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L21/48 ; H01L21/78

Abstract:
Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
Public/Granted literature
- US10700018B2 Reinforced semiconductor die and related methods Public/Granted day:2020-06-30
Information query
IPC分类: