发明申请
- 专利标题： CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT REDUCTION
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申请号： US16287668申请日： 2019-02-27
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公开(公告)号： US20200273768A1公开(公告)日： 2020-08-27
- 发明人: Omkar Karhade , Nitin Deshpande , Mitul Modi , Edvin Cetegen , Aastha Uppal , Debendra Mallik , Sanka Ganesan , Yiqun Bai , Jan Krajniak , Kumar Singh
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/532 ; H01L23/34 ; H01L23/00 ; H01L21/56
摘要：
IC packages including a heat spreading material comprising crystalline carbon. The heat spreading material may be applied directly to an IC die surface, for example at a die prep stage, prior to an application or build-up of packaging material, so that the high thermal conductivity may best mitigate any hot spots that develop at the IC die surface during operation. The heat spreading material may be applied to surface of the IC die.
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