公开(公告)号：US11574851B2

公开(公告)日：2023-02-07

申请号：US16287116

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Omkar Karhade ,  Ram Viswanath ,  Je-Young Chang ,  Weihua Tang ,  Nitin Deshpande ,  Mitul Modi ,  Edvin Cetegen ,  Sanka Ganesan ,  Yiqun Bai ,  Jan Krajniak ,  Kumar Singh

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/427 ,  H01L25/18 ,  H01L21/56

Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

公开(公告)号：US20200273772A1

公开(公告)日：2020-08-27

申请号：US16287116

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Omkar Karhade ,  Ram Viswanath ,  Je-Young Chang ,  Weihua Tang ,  Nitin Deshpande ,  Mitul Modi ,  Edvin Cetegen ,  Sanka Ganesan ,  Yiqun Bai ,  Jan Krajniak ,  Kumar Singh

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/427 ,  H01L25/18 ,  H01L21/56

Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

公开(公告)号：US20200273811A1

公开(公告)日：2020-08-27

申请号：US16287665

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Mitul Modi ,  Sanka Ganesan ,  Edvin Cetegen ,  Omkar Karhade ,  Ravindranath Mahajan ,  James C. Matayabas, Jr. ,  Jan Krajniak ,  Kumar Singh ,  Aastha Uppal

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/29 ,  H01L23/34 ,  H01L23/00 ,  H01L21/56 ,  H01L23/532

Abstract: IC package including a material preform comprising graphite. The material preform may have a thermal conductivity higher than that of other materials in the package and may therefore mitigate the formation of hot spots within an IC die during device operation. The preform may have high electrical conductivity suitable for EMI shielding. The preform may comprise a graphite sheet that can be adhered to a package assembly with an electrically conductive adhesive, applied, for example over an IC die surface and a surrounding package dielectric material. Electrical interconnects of the package may be coupled to the graphite sheet as an EMI shield. The package preform may be grounded to a reference potential through electrical interconnects of the package, which may be further coupled to a system-level ground plane. System-level thermal solutions may interface with the package-level graphite sheet.

公开(公告)号：US20200273768A1

公开(公告)日：2020-08-27

申请号：US16287668

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Omkar Karhade ,  Nitin Deshpande ,  Mitul Modi ,  Edvin Cetegen ,  Aastha Uppal ,  Debendra Mallik ,  Sanka Ganesan ,  Yiqun Bai ,  Jan Krajniak ,  Kumar Singh

IPC: H01L23/31 ,  H01L23/532 ,  H01L23/34 ,  H01L23/00 ,  H01L21/56

Abstract: IC packages including a heat spreading material comprising crystalline carbon. The heat spreading material may be applied directly to an IC die surface, for example at a die prep stage, prior to an application or build-up of packaging material, so that the high thermal conductivity may best mitigate any hot spots that develop at the IC die surface during operation. The heat spreading material may be applied to surface of the IC die.