Invention Application
- Patent Title: SOLDER BUMP FORMATION USING WAFER WITH RING
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Application No.: US16661686Application Date: 2019-10-23
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Publication No.: US20210028051A1Publication Date: 2021-01-28
- Inventor: Takashi NOMA , Noboru OKUBO , Yusheng LIN
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L23/00 ; H01L21/683 ; H01L21/78 ; H01L29/861 ; H01L29/739
Abstract:
At least one circuit element may be formed on a front side of a ringed substrate, and the ringed substrate may be mounted on a mounting chuck. The mounting chuck may have an inner raised portion configured to receive the thinned portion of the substrate thereon, and a recessed ring around a perimeter of the mounting chuck configured to receive the outer ring of the ringed substrate therein. At least one solder bump may be formed that is electrically connected to the at least one circuit element, while the ringed wafer is disposed on the mounting chuck.
Public/Granted literature
- US11264264B2 Solder bump formation using wafer with ring Public/Granted day:2022-03-01
Information query
IPC分类:
