- 专利标题： HIGH-THERMAL CONDUCTIVE EPOXY COMPOUND AND COMPOSITION, MATERIAL FOR SEMICONDUCTOR PACKAGE, MOLDED PRODUCT, ELECTRIC AND ELECTRONIC DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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申请号： US16898761申请日： 2020-06-11
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公开(公告)号： US20210147612A1公开(公告)日： 2021-05-20
- 发明人: Kyeong Pang , In Kim , Jonghoon Won , Mooho Lee , Hyejeong Lee , Songwon Hyun
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2019-0146181 20191114
- 主分类号： C08G59/24
- IPC分类号： C08G59/24 ; C08G59/26 ; C08G59/62 ; C08L63/00 ; C09D163/00 ; C09D5/00 ; C09K5/14 ; H01L33/56 ; H01L33/62 ; H01L33/64
摘要：
A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.
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