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公开(公告)号：US11901499B2
公开(公告)日：2024-02-13
申请号：US16851617
申请日：2020-04-17
发明人： Song Won Hyun , In Kim , Kyeong Pang , Moo Ho Lee , Hye Jeong Lee , In Su Lee
IPC分类号： H01M10/0525 , H01M50/24 , H01M50/55 , H01M50/553 , H01M50/122 , H01M50/117 , H01M50/131 , H01M50/141 , H01M50/16 , H01M50/157 , H01M50/162 , H01M50/121
CPC分类号： H01M10/0525 , H01M50/117 , H01M50/121 , H01M50/122 , H01M50/131 , H01M50/141 , H01M50/157 , H01M50/16 , H01M50/162 , H01M50/24 , H01M50/55 , H01M50/553 , H01M2220/20
摘要： A composite including a polymer matrix; an inorganic moisture absorber; a ceramic filler, graphite, or a combination thereof; and a tracking resistance polymer, wherein the tracking resistance polymer includes an average bond energy between an atom forming a main chain and another atom covalently bonded to the atom that forms the main chain of about 350 kJ/mol to about 500 kJ/mol; a carbonaceous residue yield after pyrolysis of less than or equal to about 5 weight percent, based on the amount of the tracking resistance polymer before pyrolysis; or a combination thereof.
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公开(公告)号：US11827742B2
公开(公告)日：2023-11-28
申请号：US17404480
申请日：2021-08-17
发明人： Jonghoon Won , Dahye Park , Kyeong Pang , In Kim
CPC分类号： C08G59/26 , C08G59/063 , C08G59/621 , C08L63/00 , C08G2190/00 , C08L2203/206
摘要： An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article:
E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-E2 Formula 1
E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-(L5)b5-A-(L6)b6-(M4)a3-(L3)b3-M6-(L4)b4-(M5)a4-E2 Formula 2
wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.-
公开(公告)号：US20210147612A1
公开(公告)日：2021-05-20
申请号：US16898761
申请日：2020-06-11
发明人： Kyeong Pang , In Kim , Jonghoon Won , Mooho Lee , Hyejeong Lee , Songwon Hyun
IPC分类号： C08G59/24 , C08G59/26 , C08G59/62 , C08L63/00 , C09D163/00 , C09D5/00 , C09K5/14 , H01L33/56 , H01L33/62 , H01L33/64
摘要： A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.
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公开(公告)号：US10366804B2
公开(公告)日：2019-07-30
申请号：US15671838
申请日：2017-08-08
发明人： In Kim , Kyeong Pang , Song Won Hyun
IPC分类号： B32B3/10 , H01B1/24 , C08K3/40 , C08L55/02 , C08L69/00 , G02F1/1333 , C08L33/20 , C08L67/00 , C08K3/04
摘要： Disclosed are a conductive resin composition and a display device using the same. The display device includes a display panel, and a frame having conductivity, in which the display panel is mounted, wherein the frame is formed of a conductive resin composition and the conductive resin composition includes a resin including a polyester copolymer resin, and carbon nanotube (CNT). The conductive resin composition prevents static discharge due to electrical conductivity and improves production efficiency though simplification of the overall manufacturing process. In addition, the conductive resin composition is applicable to thin film molding due to improved moldability and self-extinguishes flames due to flame retardancy.
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公开(公告)号：US11926695B2
公开(公告)日：2024-03-12
申请号：US16898761
申请日：2020-06-11
发明人： Kyeong Pang , In Kim , Jonghoon Won , Mooho Lee , Hyejeong Lee , Songwon Hyun
IPC分类号： C08G59/24 , C08G59/26 , C08G59/62 , C08L63/00 , C09D5/00 , C09D163/00 , C09K5/14 , H01L33/56 , H01L33/62 , H01L33/64
CPC分类号： C08G59/245 , C08G59/26 , C08G59/621 , C08L63/00 , C09D5/00 , C09D163/00 , C09K5/14 , H01L33/56 , H01L33/62 , H01L33/641
摘要： A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.
E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1
In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.-
公开(公告)号：US10450458B2
公开(公告)日：2019-10-22
申请号：US15340001
申请日：2016-11-01
发明人： Moon Il Jung , In Kim , Kyeong Pang
IPC分类号： C08L23/00 , C08L75/04 , B29C48/03 , B29B9/10 , B29C45/00 , C08L77/06 , C08L77/02 , G02B27/00 , G06F15/00 , C08G67/02 , B29C48/04 , B29C48/05 , B29C48/285 , B29K83/00 , B29K101/12 , B29L31/34
摘要： The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same.The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
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公开(公告)号：US09734930B2
公开(公告)日：2017-08-15
申请号：US14489005
申请日：2014-09-17
发明人： In Kim , Kyeong Pang , Song Won Hyun
CPC分类号： H01B1/24 , C08K3/04 , C08K3/041 , C08K3/40 , C08L33/20 , C08L55/02 , C08L67/00 , C08L69/00 , G02F1/1333 , Y10T428/31507 , Y10T428/31786
摘要： Disclosed are a conductive resin composition and a display device using the same. The display device includes a display panel, and a frame having conductivity, in which the display panel is mounted, wherein the frame is formed of a conductive resin composition and the conductive resin composition includes a resin including a polyester copolymer resin, and carbon nanotube (CNT). The conductive resin composition prevents static discharge due to electrical conductivity and improves production efficiency though simplification of the overall manufacturing process. In addition, the conductive resin composition is applicable to thin film molding due to improved moldability and self-extinguishes flames due to flame retardancy.
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公开(公告)号：US11499009B2
公开(公告)日：2022-11-15
申请号：US16688203
申请日：2019-11-19
发明人： In Ki Kim , Feifei Fang , In Su Lee , Hyoungwoo Choi , In Kim , Kyeong Pang , Sung Dug Kim
IPC分类号： H01M4/02 , C08G63/60 , C08K3/22 , H01M50/116 , H01M50/155
摘要： A liquid crystal polymer including structural units derived from an aromatic hydroxy carboxylic acid in an amount of greater than about 30 mol % and less than or equal to about 50 mol %, an aromatic dicarboxylic acid which includes about 50 mol % or greater of a structural unit derived from a compound including two carboxyl groups at a meta-position of an aromatic ring in an amount greater than or equal to about 50 mol % of the amount of the structural unit derived from the aromatic hydroxy carboxylic acid, each based on total moles of the structural units in the liquid crystal polymer, and an aromatic diol that is 4,4′-dihydroxybiphenyl, hydroquinone, or a combination thereof; a composite composition including the liquid crystal polymer, an article produced from the liquid crystal polymer or the composite composition, a battery case including the article, and a battery including the battery case and an electrode assembly.
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公开(公告)号：US10851238B2
公开(公告)日：2020-12-01
申请号：US15765347
申请日：2016-08-19
发明人： Kyeong Pang , Pil Gu Kwon , In Kim , Hye Jeong Lee
IPC分类号： C08L55/02 , C08L69/00 , C08L61/04 , C08K5/17 , C08K5/529 , C08K5/49 , C08G67/02 , C08L25/12 , B29C48/92 , B29C48/80 , B29C48/00
摘要： One aspect is directed to providing a polymeric composition containing a polyketone, which is an eco-friendly material, a method for preparing the same, an electronic apparatus, and a method for preparing the same. The polymeric composition according to one aspect includes 3 to 20 parts by weight of a polyketone resin prepared with carbon monoxide as a raw material and 80 to 97 parts by weight of a thermoplastic resin including an acrylonitrile-butadiene-styrene (ABS) copolymer resin with respect to the total weight of the polymeric composition.
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公开(公告)号：US10240036B2
公开(公告)日：2019-03-26
申请号：US14883739
申请日：2015-10-15
发明人： Song Won Hyun , In Kim , Kyeong Pang
IPC分类号： C08L69/00 , H01M2/10 , B29B7/00 , B29B7/42 , B29B7/48 , B29C47/00 , B29C47/08 , B29C47/30 , B29C47/80 , B29B9/06 , C08L51/08 , C08L67/02 , C08L83/10 , B29K69/00 , B29K105/06 , B29K309/08 , B29L31/00
摘要： An eco-friendly fire-retardant polymer composition, a molded article made from the composition, and a method of manufacturing the molded article. The composition includes: a thermoplastic resin containing polycarbonate; a bio-based resin containing polytrimethylene terephthalate extracted from a biomaterial; and an impact modifier containing a core-shell type elastomer.
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