公开(公告)号：US11926695B2

公开(公告)日：2024-03-12

申请号：US16898761

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC: C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

CPC classification number: C08G59/245 ,  C08G59/26 ,  C08G59/621 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/641

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.

E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1

In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

公开(公告)号：US20210147612A1

公开(公告)日：2021-05-20

申请号：US16898761

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC: C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D163/00 ,  C09D5/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.