Disclosed herein are line patterning techniques for integrated circuit (IC) devices, as well as related devices and assemblies In some embodiments, a patterned line region of an IC device may include: a first conductive line; a second conductive line parallel to the first conductive line; a conductive bridge between the first conductive line and the second conductive line, wherein the conductive bridge is coplanar with the first conductive line and the second conductive line; and pitch-division artifacts.