Invention Application
- Patent Title: BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
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Application No.: US16721546Application Date: 2019-12-19
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Publication No.: US20210193600A1Publication Date: 2021-06-24
- Inventor: Vivek Swaminathan SRIDHARAN , Christopher Daniel MANACK , Nazila DADVAND , Salvatore Frank PAVONE , Patrick Francis THOMPSON
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
In some examples, a package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer.
Public/Granted literature
- US11410947B2 Brass-coated metals in flip-chip redistribution layers Public/Granted day:2022-08-09
Information query
IPC分类:
