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公开(公告)号：US20210050287A1
公开(公告)日：2021-02-18
申请号：US16543238
申请日：2019-08-16
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Sreenivasan K. KODURI , Nazila DADVAND
Abstract: In some examples, a system comprises a die having multiple electrical connectors extending from a surface of the die and a lead coupled to the multiple electrical connectors. The lead comprises a first conductive member; a first non-solder metal plating stacked on the first conductive member; an electroplated layer stacked on the first non-solder metal plating; a second non-solder metal plating stacked on the electroplated layer; and a second conductive member stacked on the second non-solder metal plating, the second conductive member being thinner than the first conductive member. The system also comprises a molding to at least partially encapsulate the die and the lead.
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公开(公告)号：US20190204395A1
公开(公告)日：2019-07-04
申请号：US16235939
申请日：2018-12-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Archana VENUGOPAL , Benjamin Stassen COOK , Nazila DADVAND , Luigi COLOMBO
CPC classification number: G01R33/072 , G01R15/202
Abstract: In described examples, a 3D magnetic sensing block includes a plurality of interconnected unit cells including at least a first unit cell formed of first interconnected conducting segments, and a second unit cell formed of second interconnected conducting segments. The plurality of interconnected unit cells forms a lattice. The first unit cell is a first sensing element, and the second unit cell is a second sensing element.
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公开(公告)号：US20190204252A1
公开(公告)日：2019-07-04
申请号：US16230045
申请日：2018-12-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Archana VENUGOPAL , Benjamin Stassen COOK , Nazila DADVAND , Luigi COLOMBO
CPC classification number: G01N27/127 , G01N27/128 , G01N33/0027 , H01L21/02527 , H01L21/02606 , H01L29/0669 , H01L29/1606
Abstract: A gas sensor has a microstructure sensing element which comprises a plurality of interconnected units wherein the units are formed of connected graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.
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公开(公告)号：US20240246317A1
公开(公告)日：2024-07-25
申请号：US18585500
申请日：2024-02-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Luigi COLOMBO , Nazila DADVAND , Benjamin Stassen COOK , Archana VENUGOPAL
CPC classification number: B32B9/007 , B32B9/041 , B32B9/045 , C01B32/184 , C01B32/19 , C23C18/32 , C23C18/38 , H01M50/00 , B32B2305/38 , B32B2457/14 , B82Y30/00 , C01P2002/20 , Y10T428/30
Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.
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公开(公告)号：US20200024130A1
公开(公告)日：2020-01-23
申请号：US16042595
申请日：2018-07-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Nazila DADVAND , Kathryn SCHUCK
Abstract: A semiconductor package including a semiconductor die and at least one bondline positioned on the semiconductor die, the at least one bondline comprising a nickel lanthanide alloy diffusion barrier layer abutting a gold layer.
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Patent Agency Ranking
公开(公告)号：US20190202696A1
公开(公告)日：2019-07-04
申请号：US16230070
申请日：2018-12-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Luigi COLOMBO , Nazila DADVAND , Benjamin Stassen COOK , Archana VENUGOPAL
IPC: C01B21/064 , C23C16/34 , C23C18/32 , C23C18/16
CPC classification number: C01B21/0648 , C01P2004/22 , C01P2004/30 , C23C16/342 , C23C18/1641 , C23C18/32 , G03F1/20 , G03F1/60
Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of hexagonal boron nitride (h-BN) tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing an h-BN precursor on the metal microlattice, converting the h-BN precursor to h-BN, and removing the metal microlattice.
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公开(公告)号：US20220169773A1
公开(公告)日：2022-06-02
申请号：US17675055
申请日：2022-02-18
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Nazila DADVAND , Benjamin Stassen COOK , Archana VENUGOPAL , Luigi COLOMBO
IPC: C08F292/00 , C08F8/42 , C08L33/12 , C08K3/08 , C08K7/00 , C08J5/24 , G03F1/78 , C08K3/04 , C08J5/00
Abstract: A method of forming a composite material includes photo-initiating a polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice. Unpolymerized monomer is removed from the polymer microlattice. The polymer microlattice is coated with a metal. The metal-coated polymer microlattice is dispersed in a polymer matrix.
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公开(公告)号：US20190202174A1
公开(公告)日：2019-07-04
申请号：US16229668
申请日：2018-12-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Luigi COLOMBO , Nazila DADVAND , Benjamin Stassen COOK , Archana VENUGOPAL
CPC classification number: B32B9/007 , B32B9/041 , B32B9/045 , B32B2305/38 , B32B2457/14 , C01B32/19 , C01P2002/20 , C23C18/32 , C23C18/38
Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.
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公开(公告)号：US20190109109A1
公开(公告)日：2019-04-11
申请号：US16038598
申请日：2018-07-18
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Nazila DADVAND , Christopher Daniel MANACK , Salvatore Frank PAVONE
IPC: H01L23/00
Abstract: A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1
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公开(公告)号：US20230272536A1
公开(公告)日：2023-08-31
申请号：US17683222
申请日：2022-02-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Nazila DADVAND
IPC: C23C22/40 , H01L21/48 , H01L21/56 , H01L23/495 , H01L23/31
CPC classification number: C23C22/40 , H01L21/4835 , H01L21/565 , H01L23/49586 , H01L23/3142 , H01L24/32
Abstract: In examples, a method of forming a semiconductor package comprises forming a conversion coating solution comprising a salt of a vanadate, a salt of a zirconate, or both with a complexing agent; cleaning a copper lead frame, wherein the cleaned copper lead frame comprises copper oxide on an outer surface thereof; immersing the cleaned copper lead frame in the conversion coating solution; rinsing the copper lead frame; and forming an assembly by coupling a semiconductor die to the copper lead frame, coupling the semiconductor die to a lead of the copper lead frame, applying a mold compound onto at least a portion of the outer surface of the copper lead frame, and curing the mold compound. An adhesion strength at an interface between the mold compound and the at least the portion of the outer surface of the copper lead frame is increased relative to a same assembly formed without immersing the copper lead frame in the conversion coating solution.
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