Invention Application
- Patent Title: Semiconductor Devices and Methods of Manufacture
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Application No.: US17150300Application Date: 2021-01-15
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Publication No.: US20220122922A1Publication Date: 2022-04-21
- Inventor: Chih-Hao Chen , Pu Wang , Li-Hui Cheng , Szu-Wei Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/065 ; H01L25/10 ; H01L23/00 ; H01L23/31 ; H01L21/683 ; H01L21/48 ; H01L21/56 ; H01L25/00
Abstract:
Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.
Public/Granted literature
- US11830821B2 Semiconductor devices and methods of manufacture Public/Granted day:2023-11-28
Information query
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