Invention Application
- Patent Title: METAL OXIDE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR EVALUATING METAL OXIDE FILM
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Application No.: US17431275Application Date: 2020-02-10
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Publication No.: US20220127713A1Publication Date: 2022-04-28
- Inventor: Toshimitsu OBONAI , Yasuharu HOSAKA , Kenichi OKAZAKI , Masahiro TAKAHASHI , Tomonori NAKAYAMA , Tomosato KANAGAWA , Shunpei YAMAZAKI
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP ATSUGI-SHI, KANAGAWA-KEN
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP ATSUGI-SHI, KANAGAWA-KEN
- Priority: JP2019-030643 20190222,JP2019-042866 20190308,JP2019-076585 20190412
- International Application: PCT/IB2020/050999 WO 20200210
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/08 ; H01L21/66

Abstract:
A metal oxide film with high electrical characteristics is provided. A metal oxide film with high reliability is provided. The metal oxide film contains indium, M (M is aluminum, gallium, yttrium, or tin), and zinc. In the metal oxide film, distribution of interplanar spacings d determined by electron diffraction by electron beam irradiation from a direction perpendicular to a film surface of the metal oxide film has a first peak and a second peak. The top of the first peak is positioned at greater than or equal to 0.25 nm and less than or equal to 0.30 nm, and the top of the second peak is positioned at greater than or equal to 0.15 nm and less than or equal to 0.20 nm. The distribution of the interplanar spacings d is obtained from a plurality of electron diffraction patterns of a plurality of regions of the metal oxide film. The electron diffraction is performed using an electron beam with a beam diameter of greater than or equal to 0.3 nm and less than or equal to 10 nm.
Information query
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