Invention Application
- Patent Title: Optical Sensor for Inspecting Pattern Collapse Defects
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Application No.: US17088885Application Date: 2020-11-04
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Publication No.: US20220139743A1Publication Date: 2022-05-05
- Inventor: Ivan MALEEV , Yan CHEN , Ching-Ling MENG , Xinkang TIAN
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01N21/55 ; G01N21/95 ; G01N23/2251

Abstract:
An apparatus for detecting defects on a sample is provided. The apparatus includes a stage for receiving a sample to be inspected, and a first light source configured to generate an incident light beam to illuminate the sample on the stage. The first light source is configured to sequentially emit light of different wavelengths in wavelength sweeps. The apparatus also includes imaging optics for collecting light scattered from the sample and for forming a detection light beam, a detector for receiving the detection light beam and acquiring images of the sample, collection optics disposed within the detection light beam and configured to direct the detection light beam to the detector, and a first light modulator. The first light modulator is configured to filter out signals from the detection light beam, where the signals originate from uniform periodicity of uniformly repeating structures on the sample.
Information query
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