- 专利标题： Workpiece Processing Apparatus with Thermal Processing Systems
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申请号： US17550154申请日： 2021-12-14
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公开(公告)号： US20220208572A1公开(公告)日： 2022-06-30
- 发明人: Rolf Bremensdorfer
- 申请人： Mattson Technology, Inc. , Beijing E-Town Semiconductor Technology Co., Ltd.
- 申请人地址： US CA Fremont; CN Beijing
- 专利权人： Mattson Technology, Inc.,Beijing E-Town Semiconductor Technology Co., Ltd.
- 当前专利权人： Mattson Technology, Inc.,Beijing E-Town Semiconductor Technology Co., Ltd.
- 当前专利权人地址： US CA Fremont; CN Beijing
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; F27B17/00 ; H05B3/00 ; F27D7/02 ; H05B1/02 ; G01J5/58 ; G01J5/10
摘要：
A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, a rotation system configured to rotate the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.