- 专利标题: SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME
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申请号: US17468739申请日: 2021-09-08
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公开(公告)号: US20220216402A1公开(公告)日: 2022-07-07
- 发明人: Hye Ji Yoon , O Ik Kwon , Yun Seung Kang , Sang-Kuk Kim , Gwang-Hyun Baek , Tae Hyung Lee , Su Jin Jeon
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2021-0001206 20210106
- 主分类号: H01L45/00
- IPC分类号: H01L45/00 ; H01L27/24 ; H01L23/528
摘要:
A semiconductor memory device in which performance is improved by reducing a wiring resistance is provided. The semiconductor memory device comprising an inter-wiring insulation film on a substrate, a first wiring pattern extending in a first direction, in the inter-wiring insulation film, a barrier insulation film that is on an upper surface of the inter-wiring insulation film, a barrier conductive pattern electrically connected to the first wiring pattern, in the barrier insulation film, a memory cell electrically connected to the barrier conductive pattern and including a selection pattern and a variable resistor pattern, and a second wiring pattern extending in a second direction intersecting the first direction, on the memory cell, wherein a width of the barrier conductive pattern in the second direction is different from a width in the second direction of a portion of the memory cell that is adjacent to the barrier conductive pattern.
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