Invention Application
- Patent Title: MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
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Application No.: US17246987Application Date: 2021-05-03
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Publication No.: US20220223618A1Publication Date: 2022-07-14
- Inventor: Feng-Ching Chu , Feng-Cheng Yang , Katherine H. Chiang , Chung-Te Lin , Chieh-Fang Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11556 ; H01L27/11519 ; H01L27/11565

Abstract:
The present disclosure provides a semiconductor structure and a method for forming a semiconductor structure. The semiconductor structure includes a substrate, and a dielectric stack over the substrate. The dielectric stack includes a first layer over the substrate and a second layer over the first layer. The semiconductor structure further includes a gate layer including a first portion traversing the second layer and a second portion extending between the first layer and the second layer.
Public/Granted literature
- US11937426B2 Memory device and manufacturing method thereof Public/Granted day:2024-03-19
Information query
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