COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING THE SAME

Invention Application

US20220246572A1 COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING THE SAME 有权

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Patent Title: COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING THE SAME
Application No.: US17694363

Application Date: 2022-03-14
Publication No.: US20220246572A1

Publication Date: 2022-08-04
Inventor: Vijayaraghavan RAJAGOPAL , Eugene Anthony PRUSS , Richard F. HILL
Applicant: Laird Technologies, Inc.
Applicant Address: US MO Chesterfield
Assignee: Laird Technologies, Inc.
Current Assignee: Laird Technologies, Inc.
Current Assignee Address: US MO Chesterfield
Main IPC: H01L23/00
IPC: H01L23/00 ; F28F13/00 ; H01L23/433

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING THE SAME

Abstract:

Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

Public/Granted literature

US11776928B2 Compressible foamed thermal interface materials and methods of making the same Public/Granted day:2023-10-03

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）