公开(公告)号：US20240105663A1

公开(公告)日：2024-03-28

申请号：US18374770

申请日：2023-09-29

Applicant: Laird Technologies, Inc.

Inventor： Vijayaraghavan RAJAGOPAL ,  Eugene Anthony PRUSS ,  Richard F. HILL

IPC: H01L23/00 ,  F28F13/00 ,  H01L23/433

CPC classification number: H01L24/29 ,  F28F13/003 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/83 ,  H01L23/3731 ,  H01L2224/29005 ,  H01L2224/29187 ,  H01L2224/29191 ,  H01L2224/29195 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2924/3025

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

公开(公告)号：US20220246572A1

公开(公告)日：2022-08-04

申请号：US17694363

申请日：2022-03-14

Applicant: Laird Technologies, Inc.

Inventor： Vijayaraghavan RAJAGOPAL ,  Eugene Anthony PRUSS ,  Richard F. HILL

IPC: H01L23/00 ,  F28F13/00 ,  H01L23/433

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

公开(公告)号：US20210202343A1

公开(公告)日：2021-07-01

申请号：US17197611

申请日：2021-03-10

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  B23P15/26

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

公开(公告)号：US20190371697A1

公开(公告)日：2019-12-05

申请号：US16529063

申请日：2019-08-01

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  B23P15/26

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

公开(公告)号：US20230223315A1

公开(公告)日：2023-07-13

申请号：US18123553

申请日：2023-03-20

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/373 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/27 ,  H01L2224/27426 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2924/16235

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

公开(公告)号：US20200219785A1

公开(公告)日：2020-07-09

申请号：US16825905

申请日：2020-03-20

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  B23P15/26

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.