公开(公告)号：US20240105663A1

公开(公告)日：2024-03-28

申请号：US18374770

申请日：2023-09-29

Applicant: Laird Technologies, Inc.

Inventor： Vijayaraghavan RAJAGOPAL ,  Eugene Anthony PRUSS ,  Richard F. HILL

IPC: H01L23/00 ,  F28F13/00 ,  H01L23/433

CPC classification number: H01L24/29 ,  F28F13/003 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/83 ,  H01L23/3731 ,  H01L2224/29005 ,  H01L2224/29187 ,  H01L2224/29191 ,  H01L2224/29195 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2924/3025

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

公开(公告)号：US20220246572A1

公开(公告)日：2022-08-04

申请号：US17694363

申请日：2022-03-14

Applicant: Laird Technologies, Inc.

Inventor： Vijayaraghavan RAJAGOPAL ,  Eugene Anthony PRUSS ,  Richard F. HILL

IPC: H01L23/00 ,  F28F13/00 ,  H01L23/433

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.