公开(公告)号：US20180255666A1

公开(公告)日：2018-09-06

申请号：US15912067

申请日：2018-03-05

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Eugene Anthony PRUSS ,  Gerald R. ENGLISH

IPC: H05K9/00 ,  B32B37/20 ,  H05K1/03 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K9/0024 ,  B26F1/00 ,  B32B37/206 ,  B32B38/04 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2457/08 ,  H05K1/0216 ,  H05K1/0393 ,  H05K3/321 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4691 ,  H05K9/003 ,  H05K9/0084 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/10371

Abstract: According to various aspects, disclosed are exemplary embodiments of a multilayered thin film board level shield and exemplary embodiments of a system in package that comprise a a multilayer flexible board level shield. Also disclosed are exemplary embodiments of methods relating to making multilayer thin film board level shields. Additional exemplary embodiments are disclosed of systems and methods of applying board level shielding.

公开(公告)号：US20190229035A1

公开(公告)日：2019-07-25

申请号：US16250214

申请日：2019-01-17

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Eugene Anthony PRUSS

IPC: H01L23/373 ,  C09K5/14 ,  C08L25/08 ,  C08J9/228 ,  C08J9/00

Abstract: Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.

公开(公告)号：US20240105663A1

公开(公告)日：2024-03-28

申请号：US18374770

申请日：2023-09-29

Applicant: Laird Technologies, Inc.

Inventor： Vijayaraghavan RAJAGOPAL ,  Eugene Anthony PRUSS ,  Richard F. HILL

IPC: H01L23/00 ,  F28F13/00 ,  H01L23/433

CPC classification number: H01L24/29 ,  F28F13/003 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/83 ,  H01L23/3731 ,  H01L2224/29005 ,  H01L2224/29187 ,  H01L2224/29191 ,  H01L2224/29195 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2924/3025

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

公开(公告)号：US20200051891A1

公开(公告)日：2020-02-13

申请号：US16659058

申请日：2019-10-21

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Eugene Anthony PRUSS

IPC: H01L23/373 ,  F28F21/02 ,  F28F21/06 ,  H01L23/552

Abstract: A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.

公开(公告)号：US20220246572A1

公开(公告)日：2022-08-04

申请号：US17694363

申请日：2022-03-14

Applicant: Laird Technologies, Inc.

Inventor： Vijayaraghavan RAJAGOPAL ,  Eugene Anthony PRUSS ,  Richard F. HILL

IPC: H01L23/00 ,  F28F13/00 ,  H01L23/433

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

公开(公告)号：US20190132994A1

公开(公告)日：2019-05-02

申请号：US16125361

申请日：2018-09-07

Applicant: Laird Technologies, Inc.

Inventor： Keith David JOHNSON ,  Douglas S. MCBAIN ,  Eugene Anthony PRUSS ,  Jason L. STRADER

IPC: H05K7/20 ,  H01R13/6581 ,  C09K5/14

Abstract: Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.