Invention Application
- Patent Title: RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY DEVICES
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Application No.: US17648730Application Date: 2022-01-24
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Publication No.: US20220247089A1Publication Date: 2022-08-04
- Inventor: Walter HARTNER , Tuncay ERDOEL , Klaus ELIAN , Christian GEISSLER , Bernhard RIEDER , Rainer Markus SCHALLER , Horst THEUSS , Maciej WOJNOWSKI
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102021102228.2 20210201
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q1/52 ; H01Q1/38 ; H01Q1/16

Abstract:
A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.
Public/Granted literature
- US12040543B2 Radio-frequency devices and methods for producing radio-frequency devices Public/Granted day:2024-07-16
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