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    RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY DEVICES
    1.
    发明申请
    RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY DEVICES 有权

    公开(公告)号：US20220247089A1

    公开(公告)日：2022-08-04

    申请号：US17648730

    申请日：2022-01-24

    Applicant: Infineon Technologies AG

    Inventor： Walter HARTNER ,  Tuncay ERDOEL ,  Klaus ELIAN ,  Christian GEISSLER ,  Bernhard RIEDER ,  Rainer Markus SCHALLER ,  Horst THEUSS ,  Maciej WOJNOWSKI

    IPC: H01Q21/00 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/16

    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

    RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS
    3.
    发明申请
    RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS 有权

    公开(公告)号：US20220059918A1

    公开(公告)日：2022-02-24

    申请号：US17444864

    申请日：2021-08-11

    Applicant: Infineon Technologies AG

    Inventor： Walter HARTNER ,  Bernhard RIEDER

    IPC: H01P3/12 ,  H01Q1/50 ,  H05K1/02

    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.

    RADIO-FREQUENCY DEVICE WITH RADIO-FREQUENCY SIGNAL CARRYING ELEMENT AND ASSOCIATED PRODUCTION METHOD
    4.
    发明申请
    RADIO-FREQUENCY DEVICE WITH RADIO-FREQUENCY SIGNAL CARRYING ELEMENT AND ASSOCIATED PRODUCTION METHOD 有权

    公开(公告)号：US20210125021A1

    公开(公告)日：2021-04-29

    申请号：US16949155

    申请日：2020-10-15

    Applicant: Infineon Technologies AG

    Inventor： Bernhard RIEDER ,  Thomas KILGER

    IPC: G06K19/077 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

    Abstract: A radio-frequency device comprises a radio-frequency chip, a first connecting element arranged over a chip surface of the radio-frequency chip, the first connecting element being designed to mechanically and electrically connect the radio-frequency chip to a circuit board, and a radio-frequency signal carrying element arranged over the chip surface and electrically coupled to the radio-frequency chip, the radio-frequency signal carrying element being covered by an electrically nonconductive material and being designed to transmit a signal in a direction parallel to the chip surface, wherein the first connecting element and the radio-frequency signal carrying element are arranged at a same level in relation to a direction perpendicular to the chip surface, and wherein the first connecting element is spaced apart from the radio-frequency signal carrying element by way of a region that is free of the electrically nonconductive material.

    RADAR PACKAGE WITH OPTICAL LENS FOR RADAR WAVES
    6.
    发明申请
    RADAR PACKAGE WITH OPTICAL LENS FOR RADAR WAVES 有权

    公开(公告)号：US20220359328A1

    公开(公告)日：2022-11-10

    申请号：US17308472

    申请日：2021-05-05

    Applicant: Infineon Technologies AG

    Inventor： Bernhard RIEDER ,  Thomas KILGER

    IPC: H01L23/31 ,  H01L21/56 ,  H01Q1/22 ,  H01Q19/06

    Abstract: A radar chip package includes a radar monolithic microwave integrated circuit (MMIC) having a backside, a frontside arranged opposite to the backside, and lateral sides that extend between the backside and the frontside, wherein the radar MIMIC comprises a recess that extends from the backside at least partially towards the frontside; a plurality of electrical interfaces coupled to the frontside of the radar MIMIC; at least one antenna arranged at the frontside of the radar MIMIC; and a lens formed over the recess and the at least one antenna, wherein the lens is coupled to the backside of the radar MMIC.

    CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTERFACE
    8.
    发明申请
    CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTERFACE 有权

    公开(公告)号：US20220415830A1

    公开(公告)日：2022-12-29

    申请号：US17356831

    申请日：2021-06-24

    Applicant: Infineon Technologies AG

    Inventor： Tuncay ERDOEL ,  Walter HARTNER ,  Ulrich MOELLER ,  Bernhard RIEDER ,  Ernst SELER ,  Maciej WOJNOWSKI

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01P3/12 ,  H01Q1/22

    Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

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