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    CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTERFACE
    5.
    发明申请
    CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTERFACE 有权

    公开(公告)号：US20220415830A1

    公开(公告)日：2022-12-29

    申请号：US17356831

    申请日：2021-06-24

    Applicant: Infineon Technologies AG

    Inventor： Tuncay ERDOEL ,  Walter HARTNER ,  Ulrich MOELLER ,  Bernhard RIEDER ,  Ernst SELER ,  Maciej WOJNOWSKI

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01P3/12 ,  H01Q1/22

    Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

    RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY DEVICES
    6.
    发明申请
    RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY DEVICES 有权

    公开(公告)号：US20220247089A1

    公开(公告)日：2022-08-04

    申请号：US17648730

    申请日：2022-01-24

    Applicant: Infineon Technologies AG

    Inventor： Walter HARTNER ,  Tuncay ERDOEL ,  Klaus ELIAN ,  Christian GEISSLER ,  Bernhard RIEDER ,  Rainer Markus SCHALLER ,  Horst THEUSS ,  Maciej WOJNOWSKI

    IPC: H01Q21/00 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/16

    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

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