Invention Application
- Patent Title: MULTI-DIE STACKS WITH POWER MANAGEMENT
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Application No.: US17732792Application Date: 2022-04-29
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Publication No.: US20220253119A1Publication Date: 2022-08-11
- Inventor: Rajashree Baskaran , Maruti Gupta Hyde , Min Suet Lim , Van Le , Hebatallah Saadeldeen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F1/3203
- IPC: G06F1/3203 ; G06F1/3234 ; H01L25/16 ; G06N3/063 ; H01L25/065 ; G06F1/20 ; H01L25/18

Abstract:
Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example integrated circuit (IC) package includes a computer processor unit (CPU) die, a memory die, inference engine circuitry within the CPU die, the inference engine circuitry to infer, based on a first machine learning model, a workload for at least one of the CPU die or the memory die, and power management engine circuitry within the CPU die, the power management engine circuitry distinct from the inference engine circuitry, the power management engine circuitry to adjust, based on a second machine learning model different than the first machine learning model, operational parameters associated with the at least one of the CPU die or the memory die, the inferred workload to be an input to the second machine learning model.
Public/Granted literature
- US11822410B2 Multi-die stacks with power management Public/Granted day:2023-11-21
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