MULTI-DIE STACKS WITH POWER MANAGEMENT

    公开(公告)号:US20220253119A1

    公开(公告)日:2022-08-11

    申请号:US17732792

    申请日:2022-04-29

    Abstract: Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example integrated circuit (IC) package includes a computer processor unit (CPU) die, a memory die, inference engine circuitry within the CPU die, the inference engine circuitry to infer, based on a first machine learning model, a workload for at least one of the CPU die or the memory die, and power management engine circuitry within the CPU die, the power management engine circuitry distinct from the inference engine circuitry, the power management engine circuitry to adjust, based on a second machine learning model different than the first machine learning model, operational parameters associated with the at least one of the CPU die or the memory die, the inferred workload to be an input to the second machine learning model.

    Methods and apparatus to collect and analyze rating information

    公开(公告)号:US11308510B2

    公开(公告)日:2022-04-19

    申请号:US16147133

    申请日:2018-09-28

    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to collect and analyze driver rating information. An example apparatus includes at least one of an audio input device or a video input device to collect at least one of audio or video; a rating input device to receive a rating associated with a person; a first rating analyzer to analyze the at least one of the audio or the video to determine demographic information for the person; and a second rating analyzer to: analyze the demographic information, the rating, and historical rating information to detect a demographic trend in the rating information; and output an indication of the trend.

    MULTI-DIE STACKS WITH POWER MANAGEMENT
    8.
    发明申请

    公开(公告)号:US20190050040A1

    公开(公告)日:2019-02-14

    申请号:US16146463

    申请日:2018-09-28

    Abstract: Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example multi-die package includes a computer processor unit (CPU) die, a memory die stacked in vertical alignment with the CPU die, and artificial intelligence (AI) architecture circuitry to infer a workload for at least one of the CPU die or the memory die. The AI architecture circuitry is to manage power consumption of at least one of the CPU die or the memory die based on the inferred workload.

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