Invention Application
- Patent Title: ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
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Application No.: US17591943Application Date: 2022-02-03
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Publication No.: US20220334476A1Publication Date: 2022-10-20
- Inventor: Masafumi KOJIMA , Aina Ushiyama , Akiyoshi Goto , Michihiro Shirakawa , Keita Kato , Kazuhiro Marumo , Hironori Oka
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2019-153513 20190826,JP2020-109700 20200625
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/038 ; G03F7/039 ; C07C381/12 ; C07C311/51 ; C07C311/48 ; C07C309/12 ; C07C309/17
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition includes an acid-decomposable resin and a specific compound, in which the specific compound has two or more cationic moieties and the same number of anionic moieties as that of the cationic moieties, and at least one of the cationic moieties has a group represented by General Formula (I).
Information query
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