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公开(公告)号:US12264136B2
公开(公告)日:2025-04-01
申请号:US17480822
申请日:2021-09-21
Applicant: FUJIFILM Corporation
Inventor: Aina Ushiyama
IPC: C07D265/06 , C07C231/12
Abstract: In a production method for a hemiaminal compound, a compound represented by Formula (1), a compound represented by Formula (2), and an oxidizing agent are mixed. A hemiaminal compound represented by Formula (3) is obtained. In a production method for a heterocyclic compound, a hemiaminal compound is mixed with a base.
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公开(公告)号:US20230236502A1
公开(公告)日:2023-07-27
申请号:US18185115
申请日:2023-03-16
Applicant: FUJIFILM Corporation
Inventor: Masafumi KOJIMA , Aina Ushiyama , Yosuke Bekki , Akiyoshi Goto , Michihiro Shirakawa
CPC classification number: G03F7/0217 , G03F7/031 , G03F7/0035 , G03F7/2002 , G03F7/32 , G03F7/0015
Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition capable of obtaining a pattern having a good shape, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a salt including a cation represented by Formula (X) and a resin of which polarity increases through decomposition by the action of an acid.
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公开(公告)号:US20220334476A1
公开(公告)日:2022-10-20
申请号:US17591943
申请日:2022-02-03
Applicant: FUJIFILM Corporation
Inventor: Masafumi KOJIMA , Aina Ushiyama , Akiyoshi Goto , Michihiro Shirakawa , Keita Kato , Kazuhiro Marumo , Hironori Oka
IPC: G03F7/004 , G03F7/038 , G03F7/039 , C07C381/12 , C07C311/51 , C07C311/48 , C07C309/12 , C07C309/17
Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an acid-decomposable resin and a specific compound, in which the specific compound has two or more cationic moieties and the same number of anionic moieties as that of the cationic moieties, and at least one of the cationic moieties has a group represented by General Formula (I).
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公开(公告)号:US20230148344A1
公开(公告)日:2023-05-11
申请号:US18059329
申请日:2022-11-28
Applicant: FUJIFILM Corporation
Inventor: Akiyoshi GOTO , Akira Takada , Aina Ushiyama , Masafumi Kojima , Michihiro Shirakawa
CPC classification number: G03F7/0382 , G03F7/0392
Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR performance can be obtained, a resist film, a pattern forming method, a method for manufacturing an electronic device, a compound, and a method for producing the compound. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention is an actinic ray-sensitive or radiation-sensitive resin composition including a resin having a repeating unit having a group having a polarity that increases through decomposition by the action of an acid, in which the actinic ray-sensitive or radiation-sensitive resin composition further includes, in addition to the resin, a compound having at least one cation represented by General Formula (1), or the resin further has, in addition to the repeating unit, a repeating unit having the cation represented by General Formula (1).
(Rd1)m—[Xd1]+-(Ld1-Ard1—(S—Xd2)p)n (1)-
公开(公告)号:US20230139891A1
公开(公告)日:2023-05-04
申请号:US18063395
申请日:2022-12-08
Applicant: FUJIFILM Corporation
Inventor: Masafumi Kojima , Akira Takada , Akiyoshi Goto , Takeshi Kawabata , Aina Ushiyama
Abstract: A first object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having a good shape can be obtained. Furthermore, a second object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition. In addition, a third object of the present invention is to provide a compound which can be suitably used in the actinic ray-sensitive or radiation-sensitive resin composition.
The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a compound that generates an acid upon irradiation with actinic rays or radiation, an acid-decomposable resin having a weight-average molecular weight of 30,000 or less, and a solvent, and the compound that generates an acid upon irradiation with actinic rays or radiation includes a compound (I).
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