Invention Application
- Patent Title: METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF
-
Application No.: US17809847Application Date: 2022-06-29
-
Publication No.: US20220336220A1Publication Date: 2022-10-20
- Inventor: Pei-Yu WANG , Zhi-Chang LIN , Ching-Wei TSAI , Kuan-Lun CHENG
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/8234 ; H01L29/06 ; H01L21/3213 ; H01L21/3105 ; H01L29/66 ; H01L27/088

Abstract:
A semiconductor device includes a first fin, a second fin, a first gate electrode having a first portion that at least partially wraps around an upper portion of the first fin and a second portion that at least partially wraps around an upper portion of the second fin, a second gate electrode having a portion that at least partially wraps around the upper portion of the first fin, and a gate-cut feature having a first portion in the first gate electrode between the first and second portions of the first gate electrode. The gate-cut feature is at least partially filled with one or more dielectric materials. In a direction of a longitudinal axis of the first fin, the gate-cut feature has a second portion extending to a sidewall of the second gate electrode.
Public/Granted literature
- US11676819B2 Method for metal gate cut and structure thereof Public/Granted day:2023-06-13
Information query
IPC分类: