Invention Application
- Patent Title: DIE-TO-DIE INTERCONNECT
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Application No.: US17852865Application Date: 2022-06-29
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Publication No.: US20220342840A1Publication Date: 2022-10-27
- Inventor: Debendra Das Sharma , Swadesh Choudhary , Narasimha Lanka , Lakshmipriya Seshan , Gerald Pasdast , Zuoguo Wu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/42
- IPC: G06F13/42

Abstract:
A port is to couple to another die over a die-to-die (D2D) link and includes physical layer (PHY) circuitry including a first number of sideband lanes to carry data for use in training and management of the D2D link, and a second number of mainband lanes to implement a main data path of the D2D link. The mainband lanes include a forwarded clock lane, a valid lane, and a plurality of data lanes. A logical PHY coordinates functions of the sideband lanes and the mainband lanes.
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