- 专利标题： Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
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申请号： US17773331申请日： 2020-10-26
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公开(公告)号： US20220376133A1公开(公告)日： 2022-11-24
- 发明人: Ivar Tangring , Gudrun Lindberg , Viktor Geringer , Sophia Huppmann
- 申请人： OSRAM Opto Semiconductors GmbH
- 申请人地址： DE Regensburg
- 专利权人： OSRAM Opto Semiconductors GmbH
- 当前专利权人： OSRAM Opto Semiconductors GmbH
- 当前专利权人地址： DE Regensburg
- 优先权： DE102019129327.8 20191030
- 国际申请： PCT/EP2020/080046 WO 20201026
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/673 ; H01L33/50 ; H01L33/62 ; H01L31/18 ; H01L31/0232
摘要：
In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.
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