公开(公告)号：US20220376133A1

公开(公告)日：2022-11-24

申请号：US17773331

申请日：2020-10-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ivar Tangring ,  Gudrun Lindberg ,  Viktor Geringer ,  Sophia Huppmann

IPC: H01L33/00 ,  H01L21/673 ,  H01L33/50 ,  H01L33/62 ,  H01L31/18 ,  H01L31/0232

Abstract: In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.