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公开(公告)号:US20220376133A1
公开(公告)日:2022-11-24
申请号:US17773331
申请日:2020-10-26
IPC分类号: H01L33/00 , H01L21/673 , H01L33/50 , H01L33/62 , H01L31/18 , H01L31/0232
摘要: In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.