Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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Application No.: US17808160Application Date: 2022-06-22
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Publication No.: US20230005763A1Publication Date: 2023-01-05
- Inventor: Kazuki KOSAI , Hideaki UDOU , Seiya FUJIMOTO , Yudai TAKANAGA , Takahito NAKASHOYA , Shogo FUKUI , Atsushi ANAMOTO , So OSADA
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2021-108852 20210630,JP2021-174421 20211026
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/02 ; B08B13/00 ; B08B3/14

Abstract:
An apparatus includes: a tank storing a processing liquid; a circulation line; a branch line; a processing part for supplying the processing liquid to a substrate at the branch line; a discharge part for reducing a storage amount of the processing liquid; a supply part for supplying a new processing liquid to the tank; and a controller including: a first determination part for determining whether the storage amount is less than a lower limit value; a first replenishment controller for replenishing the processing liquid to the tank when the storage amount is less than the lower limit value; a calculation part for calculating a replenishment amount of the processing liquid; and a second replenishment controller for reducing the storage amount and replenishing the processing liquid to the tank when a calculation value of the replenishment amount is less than a set value.
Public/Granted literature
Information query
IPC分类: