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1.发明申请FLOW-RATE REGULATOR DEVICE, DILUTED CHEMICAL-LIQUID SUPPLY DEVICE, LIQUID PROCESSING APPARATUS AND ITS OPERATING SYSTEM 审中-公开流量调节装置，液体化学液体供应装置，液体加工装置及其操作系统公开(公告)号：US20150380280A1
公开(公告)日：2015-12-31
申请号：US14850139
申请日：2015-09-10
Applicant: TOKYO ELECTRON LIMITED
Inventor： Michitaka AMIYA , Takami SATOH , Kazuyoshi ESHIMA , Akihiro NAKAMURA , Koji TANAKA , Kazuki KOSAI
CPC classification number: H01L21/67051 , B01D19/02 , B01F3/0865 , B01F15/00357 , B01F15/026 , B01F2215/0077 , B08B3/08 , G05D7/01 , G05D11/138 , H01L21/67017
Abstract: A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.
Abstract translation: 用于控制液体流速的流量调节装置包括位于液体管线上游侧的第一流量调节部件和位于液体管线下游侧的第二流量调节部件， 与第一流量调节器组件串联连接。 第一流量调节器部件调节打开程度，使得当第二流量调节器部件具有完全打开时，流过液体管线的液体的流量被设定为大于目标流量的指定次数， 并且第二流量调节器部件调节开度，使得当将第一流量调节器部件调节为具有开度时，流过液体管线的液体的流量将处于目标流量 。
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公开(公告)号：US20230268207A1
公开(公告)日：2023-08-24
申请号：US18297042
申请日：2023-04-07
Applicant: Tokyo Electron Limited
Inventor： Hiroki SAKURAI , Kazuki KOSAI , Kazuyoshi SHINOHARA
CPC classification number: H01L21/67253 , B08B3/022 , B08B13/00 , H01L21/67023
Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.
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公开(公告)号：US20230264233A1
公开(公告)日：2023-08-24
申请号：US18004132
申请日：2021-06-22
Applicant: Tokyo Electron Limited
Inventor： Kazuki KOSAI , Taisei INOUE , Yusuke TAKAMATSU , Takahisa OTSUKA , Masaru AMAI , Itaru KANNO , Hiroshi YANO
IPC: B08B3/14 , H01L21/67 , B01D29/56 , B01D29/60 , B01D35/143
CPC classification number: B08B3/14 , H01L21/67017 , B01D29/56 , B01D29/60 , B01D35/143 , B08B3/022
Abstract: A liquid processing apparatus includes: a storage tank that stores a processing liquid; a first circulation line that causes the processing liquid sent from the storage tank to pass through a first filter and to return to the storage tank; and at least one second circulation line that causes the processing liquid to pass through a second filter and to return to the storage tank, wherein the second circulation line is shorter in a flow path than the first circulation line, a second flow rate of the processing liquid flowing into the second circulation line is smaller than a first flow rate of the processing liquid flowing into the first circulation line at a downstream side of a location where the first circulation line and the second circulation line are joined, and the second filter is smaller in a filtration amount per unit time than the first filter.
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公开(公告)号：US20230099012A1
公开(公告)日：2023-03-30
申请号：US17905551
申请日：2021-02-22
Applicant: Tokyo Electron Limited
Inventor： Hiroki SAKURAI , Kazuki KOSAI , Kazuyoshi SHINOHARA
Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.
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公开(公告)号：US20250132171A1
公开(公告)日：2025-04-24
申请号：US18917045
申请日：2024-10-16
Applicant: Tokyo Electron Limited
Inventor： So OSADA , Katsuya OKUDA , Naohiro IWANAGA , Kazuki KOSAI
IPC: H01L21/67
Abstract: A liquid supply device includes a tank storing a processing liquid, a circulation line, a pump, and a supply line for supplying the processing liquid to a liquid processor. The circulation line includes a main line, and first and second branch lines branching from the main line. The supply line includes first and second supply lines connected to the first and second branch lines, respectively. The first and second branch lines includes first and second heating mechanisms, first and second filters, first and second drain lines for draining the processing liquid, first and second branch circulation lines for returning the processing liquid to the tank, and first and second valves provided to switch a destination of the processing liquid, respectively.
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Patent Agency Ranking
公开(公告)号：US20250130597A1
公开(公告)日：2025-04-24
申请号：US18917105
申请日：2024-10-16
Applicant: Tokyo Electron Limited
Inventor： So OSADA , Katsuya OKUDA , Naohiro IWANAGA , Kazuki KOSAI , Toshiyuki SHIOKAWA
Abstract: A liquid supply device includes: a processing liquid line through which a processing liquid is supplied to a liquid processor for performing liquid processing on a substrate; a heating mechanism provided in the processing liquid line to heat the processing liquid flowing through the processing liquid line; a filter provided downstream of the heating mechanism in the processing liquid line; a drain line provided downstream of the filter in the processing liquid line and through which the processing liquid flowing through the processing liquid line is drained; a first temperature sensor configured to respectively detect a temperature of the filter, the processing liquid line, the drain line, or the processing liquid; and a controller configured to determine whether to drain the processing liquid from the drain line based on a detection result by the first temperature sensor.
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公开(公告)号：US20240290639A1
公开(公告)日：2024-08-29
申请号：US18647126
申请日：2024-04-26
Applicant: Tokyo Electron Limited
Inventor： Hiroki SAKURAI , Kazuki KOSAI , Kazuyoshi SHINOHARA
CPC classification number: H01L21/67253 , B08B3/022 , B08B13/00 , H01L21/67023
Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.
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公开(公告)号：US20230079190A1
公开(公告)日：2023-03-16
申请号：US17801911
申请日：2021-02-15
Applicant: Tokyo Electron Limited
Inventor： Kazuki KOSAI , Kazuyoshi SHINOHARA
Abstract: A substrate processing apparatus comprising a holding unit, a liquid supply unit, a recovery unit, a circulation path, a gas supply unit, and a control unit. The holding unit holds a substrate. The liquid supply unit supplies a processing liquid to a first major surface of the substrate being held by the holding unit. The recovery unit recovers the processing liquid that has been used for processing the substrate. The circulation path returns the processing liquid recovered by the recovery unit back to the liquid supply unit. The gas supply unit supplies a gas to a second major surface to the substrate being held by the holding unit opposite to the first major surface. The control unit controls the liquid supply unit and the gas supply unit. The control unit, when the processing liquid planned to be returned back to the liquid supply unit by the circulation path is supplied to the first major surface, causes the gas to be supplied to the second major surface.
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公开(公告)号：US20230005763A1
公开(公告)日：2023-01-05
申请号：US17808160
申请日：2022-06-22
Applicant: Tokyo Electron Limited
Inventor： Kazuki KOSAI , Hideaki UDOU , Seiya FUJIMOTO , Yudai TAKANAGA , Takahito NAKASHOYA , Shogo FUKUI , Atsushi ANAMOTO , So OSADA
Abstract: An apparatus includes: a tank storing a processing liquid; a circulation line; a branch line; a processing part for supplying the processing liquid to a substrate at the branch line; a discharge part for reducing a storage amount of the processing liquid; a supply part for supplying a new processing liquid to the tank; and a controller including: a first determination part for determining whether the storage amount is less than a lower limit value; a first replenishment controller for replenishing the processing liquid to the tank when the storage amount is less than the lower limit value; a calculation part for calculating a replenishment amount of the processing liquid; and a second replenishment controller for reducing the storage amount and replenishing the processing liquid to the tank when a calculation value of the replenishment amount is less than a set value.
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公开(公告)号：US20210134590A1
公开(公告)日：2021-05-06
申请号：US17070951
申请日：2020-10-15
Applicant: Tokyo Electron Limited
Inventor： Kazuki KOSAI , Kazuyoshi SHINOHARA
Abstract: A substrate processing apparatus includes a substrate processing part that supplies a processing liquid from a processing liquid supply part to a mounted substrate to execute liquid processing, a liquid drainage part that has a recovery channel connected to a storage part that stores the processing liquid and drains the processing liquid used for the liquid processing, and a control unit executes a processing recipe for the liquid processing and a cleaning recipe for cleaning the substrate processing part and the liquid drainage part. The control unit executes a cleaning operation for supplying a cleaning liquid from a cleaning liquid supply part to clean the substrate processing part and the liquid drainage part and subsequently executes a return operation for supplying the processing liquid from the processing liquid supply part to replace the cleaning liquid attached to the substrate processing part and the liquid drainage part with the processing liquid.
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