Invention Application
- Patent Title: MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
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Application No.: US17899379Application Date: 2022-08-30
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Publication No.: US20230006374A1Publication Date: 2023-01-05
- Inventor: Min Suet LIM , Luis Carlos ALVAREZ MATA , Ankita TIWARI , Xiang LI , Jun LIAO
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01L23/00 ; H01L23/32 ; H01L23/40 ; H01L25/065 ; H01R13/24
Abstract:
A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.
Information query
