- 专利标题： POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
-
申请号： US17880758申请日： 2022-08-04
-
公开(公告)号： US20230203343A1公开(公告)日： 2023-06-29
- 发明人: Ting-Kai Huang , Tawei Lin , Bin Hu , Liqing Wen , Yannan Liang
- 申请人： Fujifilm Electronic Materials U.S.A., Inc.
- 申请人地址： US RI N. Kingstown
- 专利权人： Fujifilm Electronic Materials U.S.A., Inc.
- 当前专利权人： Fujifilm Electronic Materials U.S.A., Inc.
- 当前专利权人地址： US RI N. Kingstown
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; H01L21/321 ; C09K15/30
摘要：
A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a hard mask removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.
公开/授权文献
- US11851585B2 Polishing compositions and methods of use thereof 公开/授权日：2023-12-26
信息查询
