发明公开
- 专利标题: SEMICONDUCTOR DEVICE
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申请号: US18353907申请日: 2023-07-18
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公开(公告)号: US20230361111A1公开(公告)日: 2023-11-09
- 发明人: Tatsuya NAITO
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kanagawa
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP 16047188 2016.03.10 JP 16201972 2016.10.13 JP 17024925 2017.02.14
- 分案原申请号: US15900810 2018.02.21
- 主分类号: H01L27/06
- IPC分类号: H01L27/06 ; H01L21/76 ; H01L27/07 ; H01L29/08 ; H01L29/36 ; H01L29/40 ; H01L29/861 ; H01L29/423 ; H01L29/78 ; H01L29/739 ; H01L21/765 ; H01L29/06 ; H01L29/10 ; H01L29/32
摘要:
A semiconductor device includes a semiconductor substrate having a first conductivity type drift region and a second conductivity type base region above the drift region, trench portions at an upper surface of the semiconductor substrate arrayed parallel to one another, each of them penetrating the base region, and mesa portions between respective trench portions. Among the mesa portions, at least one mesa portion includes a first conductivity type first semiconductor region having a higher concentration than the drift region, a second conductivity type second semiconductor region having a higher concentration than the base region, and a first conductivity type accumulation region between the base and drift regions and has a higher concentration than the drift region. The drift region does not extend above the accumulation region. In a longitudinal direction of the trench portions, the accumulation region extends beyond an end portion of the first semiconductor region.
公开/授权文献
- US12080707B2 Semiconductor device 公开/授权日:2024-09-03
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