发明公开
- 专利标题: Semiconductor Devices Including Ferroelectric Memory and Methods of Forming the Same
-
申请号: US18343972申请日: 2023-06-29
-
公开(公告)号: US20230368830A1公开(公告)日: 2023-11-16
- 发明人: Chenchen Wang , Sai-Hooi Yeong , Chi On Chui , Yu-Ming Lin
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 分案原申请号: US17099094 2020.11.16
- 主分类号: G11C11/22
- IPC分类号: G11C11/22 ; H01L29/78 ; H01L29/51
摘要:
A semiconductor device including a capacitor, with a memory film isolating a first electrode from a contact, formed over a transistor and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate stack over a semiconductor substrate; a capacitor over the gate stack, the capacitor including a first electrode extending along a top surface of the gate stack, the first electrode being U-shaped; a first ferroelectric layer over the first electrode; and a second electrode over the first ferroelectric layer, a top surface of the second electrode being level with a top surface of the first ferroelectric layer, and the top surface of the first ferroelectric layer and the top surface of the second electrode being disposed further from the semiconductor substrate than a topmost surface of the first electrode.
信息查询