- 专利标题： COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
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申请号： US18344308申请日： 2023-06-29
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公开(公告)号： US20230422389A1公开(公告)日： 2023-12-28
- 发明人: Prabhakar Subrahmanyam , Tejas J. Shah , Yi Xia , Ying-Feng Pang , Mark Lawrence Bianco , Vishnu Prasadh Sugumar , Vikas Kundapura Rao , Srinivasa Rao Damaraju , Ridvan Amir Sahan , Emad Shehadeh Al-Momani , Rahima Khatun Mohammed , Mirui Wang , Devdatta Prakash Kulkarni
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K7/20
摘要：
Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.
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