- 专利标题: Pulsed Capacitively Coupled Plasma Processes
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申请号: US17991527申请日: 2022-11-21
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公开(公告)号: US20230081352A1公开(公告)日: 2023-03-16
- 发明人: Peter Lowell George Ventzek , Alok Ranjan , Kensuke Taniguchi , Shinya Morikita
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 主分类号: H01L21/3065
- IPC分类号: H01L21/3065 ; H01L21/311 ; H01J37/32 ; H05H1/46
摘要:
A method of plasma processing includes cyclically performing a cycle including the steps of performing a glow phase and performing an afterglow phase. The glow phase includes providing a first SP pulse comprising a first SP power level for a first duration to an SP electrode to generate a capacitively coupled plasma in a plasma processing chamber. The first SP pulse terminates at the end of the glow phase. The afterglow phase is performed after the glow phase and includes providing a BP pulse train to a BP electrode coupled to a target substrate within the plasma processing chamber in an afterglow of the capacitively coupled plasma for a second duration between about 10 μs and about 100 μs. The BP pulse train includes a plurality of BP spikes. Each of the plurality of BP spikes is a DC pulse that has a first BP power level.
公开/授权文献
- US1649824A Galvanizing furnace 公开/授权日:1927-11-22
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